Rim Semiconductor updates

[destiny1]

April 18, 2008

Telecom Italia Selects Huawei for NG Access
Huawei Technologies announced that it will provide access network components to help Telecom Italia deploy a Next Generation Network (NGN2) in the Milan area.

Huawei will provide Telecom Italia with its Fiber to the Building (FTTB) solution, comprising SmartAX MA5600Tand MA5606T, which incorporates GPON and VDSL2 (Very High Bit-rate Digital Subscriber Line) technologies. These technologies enable broadband connection speeds of up to 100Mbps, delivering better ultra broadband experiences to the operator's customers. The solution is built on Terabit architecture, which provides a future-proof platform for Telecom Italia to roll out additional ultra broadband services.

"We are proud to further our partnership with Telecom Italia,"added Mr. William Xu, President of Europe Region, Huawei Technologies. "As the exclusive provider of FTTB technologies to Telecom Italia in the Milan area, we are committed to delivering a high-quality service. We will spare no effort in helping Telecom Italia extend its leadership in the dynamic and fast-growing broadband market."

Huawei now jumps to the top of the list of potential direct customers for CupriaTM chipsets.

This is a VRAD -VDSL 2 type device which is backwards compatibile with CupriaTM.

The MA5600T is a DSLAM which houses the line cards on which CupriaTM chips reside.
Huawei has now become the #1 IP DSLAM manufacturer worldwide. (read)

D1

[destiny1]

Question from reader?

Why are they using VDSL2. Shouldn't they have had enough time by now to decide on IPSL?

CupriaTM completed ASICs are not yet available. Once available, the CupriaTM line cards will be backwards compatable with VRAD/VDSL 2 cabinets, Rim Semi is encouraging ongoing VRAD/VDSL 2 cabinet deployment.

Telcos can deploy these cabinets using exisiting ADSL 2/VDSL 2 technology in appropriate neighborhoods.

Telcos understand that once CupriaTM is available, they will be able to use these same VRAD cabinets for CupriaTM chips.
D1

[destiny1]

Further posts on PM board:

I understand that, but it would seem that if their intent was to use IPSL they would say so instead of VDSL2

In essence they did. Recent CupriaTM telecom trials demonstrate ADSL 2 has limited bandwidth capacity and VDSL 2 didn't even work at 5500 feet. If you couple this with the fact that telcos will not widely deploy a technology upgrade unless it can serve a significant percentage of their customers, Cupria TM chipsets become the remaining choice.

D1

[Stoppmann]

Originally Posted by destiny1

Further posts on PM board:

I understand that, but it would seem that if their intent was to use IPSL they would say so instead of VDSL2

In essence they did. Recent CupriaTM telecom trials demonstrate ADSL 2 has limited bandwidth capacity and VDSL 2 didn't even work at 5500 feet. If you couple this with the fact that telcos will not widely deploy a technology upgrade unless it can serve a significant percentage of their customers, Cupria TM chipsets become the remaining choice.

D1

I understand what you are saying regarding backward compatibility of IPSL and limitations of existing technologies, but I believe that it is the intention of the telco to place these new cabinents close enough to their customer so that it will work with existing technology. Alcaltel has is providing similar cabinets. The following is what Alcatel has to say about their FTTB cabinets.

"The ISAM FTTB portfolio allows operators to deliver up to 100 Mbps over copper in multi-dwelling unit (MDU) environments, in which it can be difficult to introduce fiber. DSL service providers in markets that use the European Telecommunications Standards Institute (ETSI) standards can thus complement their CO & cabinet deployments, and bring fiber closer to the subscriber whenever the installation of street cabinets is not an option."

http://www.lightreading.com/document.asp?doc_id=147636

[destiny1]

Good post Stopp. That is correct. It's true VDSL 2 does has primary application in the MDU/high rise/enterprise space. In other words, on short loops of 1500 feet or less. VDSL 2 is impracticle however beyond this distance. It would be too costly to deploy fiber to the curb of every single family home.

In Asia, where high rise apartments and corporate buildings predominate, there will be ongoing application.

The question of video application, even on short loops, remain. My understanding is that latency issues remain which creates picture quality issues.

VDSL 2 will continue to be a good data pump over short distances where real time video application is not a concern.

D1

[destiny1]

The Complexity of Seamless

Rim Semi has made several announcements regarding telecom equipment trials. Some have concern for the seeming delay while waiting for new announcements.

It’s natural to think that once a telco has seen the rm-CDS 6000 field hardened test module and Cupria 5101a line card, it’s simple to transition those results into a purchase order. (read)

In truth, the telco decision process regarding new equipment deployment is far more complex. A few days ago we talked briefly about the four components of IPTV deployment: content distribution, middleware, transport infrastructure and customer premise equipment (CPE). The white paper below only addresses the last two: transport infrastructure and CPE. The added cost of content distribution and middleware can by themselves, derail IPTV deployment plans.

In February 2008, the World & Ethernet Congress 08 performed the first worldwide interoperability testing of current network backbone and access equipment utilized in both fixed and wirelines applications. The goal behind the testing is to demonstrate interoperability between devices.

http://metroethernetforum.org / PDF_Documents / EANTC-MBH08-WhitePaper-M...

To put things into perspective, look at the diagram on pages 6-7. This diagram represents what is required to send a simple voice, video or text message between various fixed or wireless devices… multiplied by many millions!

Notice how the varied network devices are required to interoperate. Note that if there is a snag at any link in the chain, quality of service issues arise and service suffers.

Rim Semi CupriaTM chipsets sit in the green area (access) in for example the Huawei SmartAX MA 5600T (DSLAM) and the RAD LA 110 access device (CPE).

Extra points if you can even find these two pieces of equipment in this huge puzzle!
Hint: look at the bottom left hand portion of page 6!

Needless to say, once one begins to understand the complexity of sending data or video signals over a worldwide networks, we gain more appreciation for why changes in telecommunications come very slowly and why purchase decisions involve far more than testing CupriaTM chipsets. On the other hand, once a technology is adopted and demonstrated a real solution, it will be equally difficult to displace.

D1

[Stoppmann]

Originally Posted by destiny1

The Complexity of Seamless

Rim Semi has made several announcements regarding telecom equipment trials. Some have concern for the seeming delay while waiting for new announcements.http://ticktockstock.com/forum/newreply.php?do=newreply&p=2186

It’s natural to think that once a telco has seen the rm-CDS 6000 field hardened test module and Cupria 5101a line card, it’s simple to transition those results into a purchase order. (read)

In truth, the telco decision process regarding new equipment deployment is far more complex. A few days ago we talked briefly about the four components of IPTV deployment: content distribution, middleware, transport infrastructure and customer premise equipment (CPE). The white paper below only addresses the last two: transport infrastructure and CPE. The added cost of content distribution and middleware can by themselves, derail IPTV deployment plans.

In February 2008, the World & Ethernet Congress 08 performed the first worldwide interoperability testing of current network backbone and access equipment utilized in both fixed and wirelines applications. The goal behind the testing is to demonstrate interoperability between devices.

http://metroethernetforum.org / PDF_Documents / EANTC-MBH08-WhitePaper-M...

To put things into perspective, look at the diagram on pages 6-7. This diagram represents what is required to send a simple voice, video or text message between various fixed or wireless devices… multiplied by many millions!

Notice how the varied network devices are required to interoperate. Note that if there is a snag at any link in the chain, quality of service issues arise and service suffers.

Rim Semi CupriaTM chipsets sit in the green area (access) in for example the Huawei SmartAX MA 5600T (DSLAM) and the RAD LA 110 access device (CPE).

Extra points if you can even find these two pieces of equipment in this huge puzzle!
Hint: look at the bottom left hand portion of page 6!

Needless to say, once one begins to understand the complexity of sending data or video signals over a worldwide networks, we gain more appreciation for why changes in telecommunications come very slowly and why purchase decisions involve far more than testing CupriaTM chipsets. On the other hand, once a technology is adopted and demonstrated a real solution, it will be equally difficult to displace.

D1

Interesting artlicle. Shows how complex and integrated the telco system is. How do you find this articles?

[deeba]

President's Letter


Thursday, April 24, 2008


Dear Fellow Shareholders,

Rim Semiconductor Company filed a proxy statement with the SEC in order to bring an important corporate matter to you for a vote. I and the rest of the Board of Directors unanimously agree that the number of shares that the company is authorized to issue should be increased from nine hundred million to four billion. The reasons are simple. We are obligated to reserve shares of common stock for possible future issuance in connection with outstanding options and warrants, and must also reserve sufficient shares to fulfill our obligations to various investors associated with the potential conversion of over $4 Million in convertible notes and debentures. Right now, of our 900 million authorized shares, we only have approximately 175 million shares available for issuance. We need additional shares authorized so that we will have shares available to meet our legal obligations to the holders of these existing convertible securities. Moreover, we also believe that having additional shares of common stock available for issuance, without the delay necessitated by a shareholders meeting, will provide the company with the flexibility to consider and respond to future business opportunities and financial needs as they arise. Why are we authorizing four billion shares? We do not want to have a shareholder vote again to increase our share count for many years to come, if ever.

Every time we have a shareholder vote, we have a meeting. As you will see from the proxy statement, a date, time and location has been set. It will not be like other Rim Semiconductor Company shareholder meetings that you may have attended in the past. Only one representative from Rim Semiconductor Company will be there, and it will have only one agenda item, specifically this vote. Later in the summer, we intend to have our annual shareholder meeting in Portland. We expect that the meeting will include product demonstrations, presentations, guest speakers, investor dinners and perhaps other events. We expect to announce the location and date for the Portland meeting in May.

Sincerely,

Brad Ketch
President and CEO
Rim Semiconductor Company

[destiny1]

Originally Posted by Stoppmann

Interesting artlicle. Shows how complex and integrated the telco system is. How do you find this articles?

It's amazing what one discovers when SmartAX MA 5600T is typed into the google search engine I've made available on ticktock.

D1

[Stoppmann]

Originally Posted by deeba

President's Letter


Thursday, April 24, 2008


Dear Fellow Shareholders,

Rim Semiconductor Company filed a proxy statement with the SEC in order to bring an important corporate matter to you for a vote. I and the rest of the Board of Directors unanimously agree that the number of shares that the company is authorized to issue should be increased from nine hundred million to four billion. The reasons are simple. We are obligated to reserve shares of common stock for possible future issuance in connection with outstanding options and warrants, and must also reserve sufficient shares to fulfill our obligations to various investors associated with the potential conversion of over $4 Million in convertible notes and debentures. Right now, of our 900 million authorized shares, we only have approximately 175 million shares available for issuance. We need additional shares authorized so that we will have shares available to meet our legal obligations to the holders of these existing convertible securities. Moreover, we also believe that having additional shares of common stock available for issuance, without the delay necessitated by a shareholders meeting, will provide the company with the flexibility to consider and respond to future business opportunities and financial needs as they arise. Why are we authorizing four billion shares? We do not want to have a shareholder vote again to increase our share count for many years to come, if ever.

Every time we have a shareholder vote, we have a meeting. As you will see from the proxy statement, a date, time and location has been set. It will not be like other Rim Semiconductor Company shareholder meetings that you may have attended in the past. Only one representative from Rim Semiconductor Company will be there, and it will have only one agenda item, specifically this vote. Later in the summer, we intend to have our annual shareholder meeting in Portland. We expect that the meeting will include product demonstrations, presentations, guest speakers, investor dinners and perhaps other events. We expect to announce the location and date for the Portland meeting in May.

Sincerely,

Brad Ketch
President and CEO
Rim Semiconductor Company

Product demonstrations - Now that would be something to see. I wonder if the product will contain the FPGA or ASSP?